Invention Grant
- Patent Title: Light-emitting diode package
- Patent Title (中): 发光二极管封装
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Application No.: US13030152Application Date: 2011-02-18
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Publication No.: US08476653B2Publication Date: 2013-07-02
- Inventor: Jian-Shihn Tsang
- Applicant: Jian-Shihn Tsang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99141611 20101201
- Main IPC: H01L33/48
- IPC: H01L33/48

Abstract:
A light-emitting diode (LED) package includes a first chip group, a second chip group and an optical wavelength converting substance. The first chip group includes a plurality of red LED chips configured for emitting red light. The second chip group includes a plurality of blue LED chips configured for emitting blue light. The optical wavelength converting substance is arranged on light paths of the blue LED chips. The optical wavelength converting substance is configured for partly absorbing blue light emitted from the blue LED chips and emitting visible lights with different wavelengths. The plurality of blue LED chips has a total light output larger than that of the plurality of red LED chips.
Public/Granted literature
- US20120138978A1 LIGHT-EMITTING DIODE PACKAGE Public/Granted day:2012-06-07
Information query
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