Invention Grant
- Patent Title: Plasma CVD apparatus
- Patent Title (中): 等离子体CVD装置
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Application No.: US13550776Application Date: 2012-07-17
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Publication No.: US08476638B2Publication Date: 2013-07-02
- Inventor: Satoshi Toriumi , Ryota Tajima , Takashi Ohtsuki , Tetsuhiro Tanaka , Ryo Tokumaru , Mitsuhiro Ichijo , Kazutaka Kuriki , Tomokazu Yokoi , Toshiya Endo , Shunpei Yamazaki
- Applicant: Satoshi Toriumi , Ryota Tajima , Takashi Ohtsuki , Tetsuhiro Tanaka , Ryo Tokumaru , Mitsuhiro Ichijo , Kazutaka Kuriki , Tomokazu Yokoi , Toshiya Endo , Shunpei Yamazaki
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2009-194801 20090825; JP2009-194849 20090825; JP2009-194852 20090825
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/036

Abstract:
An object of the present invention is to provide a technique for manufacturing a dense crystalline semiconductor film without a cavity between crystal grains. A plasma region is formed between a first electrode and a second electrode by supplying high-frequency power of 60 MHz or less to the first electrode under a condition where a pressure of a reactive gas in a reaction chamber of a plasma CVD apparatus is set to 450 Pa to 13332 Pa, and a distance between the first electrode and the second electrode of the plasma CVD apparatus is set to 1 mm to 20 mm; crystalline deposition precursors are formed in a gas phase including the plasma region; a crystal nucleus of 5 nm to 15 nm is formed by depositing the deposition precursors; and a microcrystalline semiconductor film is formed by growing a crystal from the crystal nucleus.
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