Invention Grant
- Patent Title: Laser cutting apparatus
- Patent Title (中): 激光切割机
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Application No.: US12407117Application Date: 2009-03-19
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Publication No.: US08476551B2Publication Date: 2013-07-02
- Inventor: Tsai-Shih Tung
- Applicant: Tsai-Shih Tung
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810300642 20080320
- Main IPC: B23K26/02
- IPC: B23K26/02 ; B29D11/00 ; B28B11/12

Abstract:
An exemplary cutting apparatus for cutting components from a sprue includes a sprue retainer, a laser cutting unit, and a rotating driving unit. The sprue retainer has a supporting surface. The supporting surface defines a receiving hole, and grooves extending across the entire supporting surface. The grooves are in communication with the receiving hole. The laser cutting unit is disposed above the sprue retainer and is configured for emitting a laser beam to cut the sprue carried on the sprue retainer. The sprue retainer is coupled to the rotating driving such that the rotating driving unit is capable of driving the sprue retainer to rotate.
Public/Granted literature
- US20090236322A1 LASER CUTTING APPARATUS Public/Granted day:2009-09-24
Information query
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