The invention relates to crosslinkable, thermoplastic polyamide molding compounds. The polyamides are selected from a group comprising amorphous or microcrystalline polyamides, copolyamides thereof and blends thereof, as well as blends of such polyamides with semicrystalline polyamides. A polyamide molding compound according to the invention is characterized in that it comprises a crosslinking additive which causes the production of crosslinked molded parts formed from said polyamide molding compound under the effect of high-energy irradiation, having a Tg value of >140° C. and a minimum dimensional stability of 90% at temperatures of ≧180° C. These polyamides have a substantially linear structure and the monomers thereof have no olefin C═C double bonds. Corresponding crosslinked polyamide molded parts produced from a polyamide molding compound and the use of this polyamide molding compound to produce these crosslinked polyamide molded parts are additionally disclosed.