Invention Grant
- Patent Title: Expanding void filler and a process of manufacturing same
- Patent Title (中): 膨胀空隙填料及其制造方法
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Application No.: US12893913Application Date: 2010-09-29
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Publication No.: US08476363B2Publication Date: 2013-07-02
- Inventor: Jason Eric Marr , Wenyu Yang , Brandon Curtis Kline , Tyrone Hines , Chris Arnoldt
- Applicant: Jason Eric Marr , Wenyu Yang , Brandon Curtis Kline , Tyrone Hines , Chris Arnoldt
- Applicant Address: US TX Fort Worth
- Assignee: Edge Adhesives, Inc.
- Current Assignee: Edge Adhesives, Inc.
- Current Assignee Address: US TX Fort Worth
- Agency: Winstead PC
- Main IPC: C09J175/08
- IPC: C09J175/08 ; C09J123/00 ; C09J121/00
Abstract:
An adhesive composition, a process of manufacture and a method of filling a surface having voids with a void filler are disclosed herein. Upon insertion between opposing surfaces or around an exposed surface, the void filler expands into and around the voids, filling surfaces having voids and covering irregularities of concrete structures.
Public/Granted literature
- US20110189393A1 EXPANDING VOID FILLER AND A PROCESS OF MANUFACTURING SAME Public/Granted day:2011-08-04
Information query
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