Invention Grant
US08476114B2 Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component
有权
用于光电子部件的壳体，光电子部件以及用于制造用于光电子部件的壳体的方法
- Patent Title: Housing for an optoelectronic component, optoelectronic component, and method for producing a housing for an optoelectronic component
- Patent Title (中): 用于光电子部件的壳体，光电子部件以及用于制造用于光电子部件的壳体的方法
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Application No.: US13275980Application Date: 2011-10-18
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Publication No.: US08476114B2Publication Date: 2013-07-02
- Inventor: Georg Bogner
- Applicant: Georg Bogner
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006046678 20060929
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for making a housing for an optoelectronic component is disclosed. The housing has a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body. The plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body.
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