Invention Grant
- Patent Title: Semiconductor workpiece carriers and methods for processing semiconductor workpieces
- Patent Title (中): 半导体工件载体和半导体工件的处理方法
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Application No.: US13094576Application Date: 2011-04-26
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Publication No.: US08476109B2Publication Date: 2013-07-02
- Inventor: Chee Peng Neo , Hong Hak Teo , Jamilon Bin Sukami
- Applicant: Chee Peng Neo , Hong Hak Teo , Jamilon Bin Sukami
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200702852 20070419
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
Public/Granted literature
- US20110287581A1 SEMICONDUCTOR WORKPIECE CARRIERS AND METHODS FOR PROCESSING SEMICONDUCTOR WORKPIECES Public/Granted day:2011-11-24
Information query
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