Invention Grant
US08476087B2 Methods for fabricating sensor device package using a sealing structure
有权
使用密封结构制造传感器装置封装的方法
- Patent Title: Methods for fabricating sensor device package using a sealing structure
- Patent Title (中): 使用密封结构制造传感器装置封装的方法
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Application No.: US13092001Application Date: 2011-04-21
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Publication No.: US08476087B2Publication Date: 2013-07-02
- Inventor: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
- Applicant: Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
Public/Granted literature
- US20120270354A1 METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUCTURE Public/Granted day:2012-10-25
Information query
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