Invention Grant
US08475870B2 Resin layer formation method, resin layer formation device, disk and disk manufacturing method
失效
树脂层形成方法，树脂层形成装置，盘和盘的制造方法
- Patent Title: Resin layer formation method, resin layer formation device, disk and disk manufacturing method
- Patent Title (中): 树脂层形成方法，树脂层形成装置，盘和盘的制造方法
-
Application No.: US13310469Application Date: 2011-12-02
-
Publication No.: US08475870B2Publication Date: 2013-07-02
- Inventor: Tomokazu Ito , Hisashi Nishigaki , Tsukasa Kawakami , Haruka Narita , Yoji Takizawa , Takumi Hanada , Munenori Iwami
- Applicant: Tomokazu Ito , Hisashi Nishigaki , Tsukasa Kawakami , Haruka Narita , Yoji Takizawa , Takumi Hanada , Munenori Iwami
- Applicant Address: JP Kanagawa
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Kanagawa
- Priority: JP2004-165220 20040603
- Main IPC: B05D3/06
- IPC: B05D3/06 ; B05D3/12
Abstract:
A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.
Public/Granted literature
- US20120076947A1 RESIN LAYER FORMATION METHOD, RESIN LAYER FORMATION DEVICE, DISK AND DISK MANUFACTURING METHOD Public/Granted day:2012-03-29
Information query
