Invention Grant
US08475058B2 Optical module with ceramic package reducing optical coupling stress
有权
具有陶瓷封装的光学模块减少光耦合应力
- Patent Title: Optical module with ceramic package reducing optical coupling stress
- Patent Title (中): 具有陶瓷封装的光学模块减少光耦合应力
-
Application No.: US12858997Application Date: 2010-08-18
-
Publication No.: US08475058B2Publication Date: 2013-07-02
- Inventor: Yasushi Fujimura , Toshio Takagi , Fumihiro Nakajima
- Applicant: Yasushi Fujimura , Toshio Takagi , Fumihiro Nakajima
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.
Public/Granted literature
- US20120045183A1 OPTICAL MODULE WITH CERAMIC PACKAGE Public/Granted day:2012-02-23
Information query