LED backlight module structure for increasing process yield comprises a housing, a copper circuit layer, a plurality of LED chips, a plurality of solder paste overflow prevention members, a light guide plate, and a bottom reflector. In the present invention, it mainly disposed the solder paste overflow prevention members between the LED chips and the copper circuit layer, therefore, the solder paste overflow phenomenon is prevented when using a pressing fixture to assist in executing the welding process of LED chips, and it ensures that the soldering pins of the LED chips would not electrically connect to each other due to the solder paste overflow phenomenon. Moreover, a position limiting band can be further disposed on the copper circuit layer for receiving and fixing the LED chips, in addition, the position limiting band is helpful to the LED chips in heat dissipation when the LED chips emit light.