Invention Grant
- Patent Title: Fluid ejecting apparatus and fluid ejecting method
- Patent Title (中): 流体喷射装置和流体喷射方法
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Application No.: US13226410Application Date: 2011-09-06
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Publication No.: US08474952B2Publication Date: 2013-07-02
- Inventor: Takeshi Yoshida , Masahiko Yoshida , Michiaki Tokunaga , Tatsuya Nakano
- Applicant: Takeshi Yoshida , Masahiko Yoshida , Michiaki Tokunaga , Tatsuya Nakano
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agent Maschoff Brennan
- Priority: JP2010-200178 20100907
- Main IPC: B41J29/38
- IPC: B41J29/38

Abstract:
A fluid ejecting apparatus includes a nozzle row in which a plurality of nozzles that eject fluid onto a medium are arranged, a first movement unit that displaces a relative position between the medium and the nozzle row, and a control unit that forms a plurality of dot-lines by repeating a fluid ejection operation in which fluid is ejected so as to form a dot-line, such that a maximum time between when one of the adjacent dot-lines in the plurality of dot-lines is formed to when the other of the adjacent dot-lines is formed is reduced.
Public/Granted literature
- US20120056924A1 FLUID EJECTING APPARATUS AND FLUID EJECTING METHOD Public/Granted day:2012-03-08
Information query
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