Invention Grant
US08474764B2 Lightweight three-dimensional wire structure and method for the production thereof 有权
轻量三维线结构及其制造方法

  • Patent Title: Lightweight three-dimensional wire structure and method for the production thereof
  • Patent Title (中): 轻量三维线结构及其制造方法
  • Application No.: US13142879
    Application Date: 2009-12-29
  • Publication No.: US08474764B2
    Publication Date: 2013-07-02
  • Inventor: Stephan KieselsteinThomas Weinrich
  • Applicant: Stephan KieselsteinThomas Weinrich
  • Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
  • Priority: DE102008063289 20081230
  • International Application: PCT/DE2009/001831 WO 20091229
  • International Announcement: WO2010/075853 WO 20100708
  • Main IPC: B21F27/02
  • IPC: B21F27/02 B21F27/00
Lightweight three-dimensional wire structure and method for the production thereof
Abstract:
A lightweight three-dimensional wire structure which includes a plurality of wires that are connected to each other and intersect in the three-dimensional space to form a plurality of cells. In addition, a method for producing the three-dimensional wire structure.
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