Invention Grant
- Patent Title: Solder apparatus
- Patent Title (中): 焊接设备
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Application No.: US13409347Application Date: 2012-03-01
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Publication No.: US08474681B1Publication Date: 2013-07-02
- Inventor: John Pereira , John P. Hendrick , Lawrence Richard Cole
- Applicant: John Pereira , John P. Hendrick , Lawrence Richard Cole
- Applicant Address: US RI Cranston
- Assignee: Antaya Technologies Corp.
- Current Assignee: Antaya Technologies Corp.
- Current Assignee Address: US RI Cranston
- Agency: Hamilton, Brook, Smith & Reynolds, P.C.
- Main IPC: B23K1/00
- IPC: B23K1/00
Abstract:
An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.
Information query
IPC分类:
