Invention Grant
- Patent Title: Sound absorbing structure
- Patent Title (中): 吸音结构
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Application No.: US13545252Application Date: 2012-07-10
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Publication No.: US08474574B1Publication Date: 2013-07-02
- Inventor: Hisaaki Kobayashi , Hiroshi Makino , Yasuhiro Suzuki , Takahiro Ogo
- Applicant: Hisaaki Kobayashi , Hiroshi Makino , Yasuhiro Suzuki , Takahiro Ogo
- Applicant Address: JP Aichi
- Assignee: Inoac Corporation
- Current Assignee: Inoac Corporation
- Current Assignee Address: JP Aichi
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: F16F15/04
- IPC: F16F15/04 ; F16F15/02

Abstract:
PROBLEMSThe present invention provides a sound absorbing structure that enables a sound absorbing rate thereof to be raised in a low-frequency region or medium-high frequency from around 500 Hz to 10 KHz, and a thickness thereof to be reduced.SOLUTIONSThe sound absorbing structure has: a non-air permeable sheet molding object having, on one surface side thereof, a plurality of cavities including recesses formed by bending; and a non-air permeable surface sheet which is layered on the sheet molding object, on a cavity open-top side surface thereof, so as to cover open-top of the plurality of cavities, wherein the surface sheet is fixed at outer peripheral sections of the sheet molding object 11 and is not fixed to the sheet molding object at portions between adjacent cavities.
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