Lamination packs of a controlled height are produced in that laminations are punched with a tool and glue is applied partially onto at least one of an upper surface and a lower surface of each of the laminations without the application device that applies the glue contacting the laminations. Several of the laminations are then assembled to a lamination pack. Height of the lamination packs is controlled by interrupting the application of glue for certain laminations so that between some of the laminations that are stacked for assembling a lamination pack there is no glue.