Invention Grant
- Patent Title: Interactive filling simulation on 3D injection molding models
- Patent Title (中): 3D注塑模型的交互式填充模拟
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Application No.: US12874949Application Date: 2010-09-02
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Publication No.: US08463584B2Publication Date: 2013-06-11
- Inventor: Huagang Yu
- Applicant: Huagang Yu
- Applicant Address: US CA San Rafael
- Assignee: Autodesk, Inc.
- Current Assignee: Autodesk, Inc.
- Current Assignee Address: US CA San Rafael
- Agency: Fish & Richardson P.C.
- Main IPC: G06F9/455
- IPC: G06F9/455

Abstract:
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for interactively simulating an injection mold model. A three-dimensional CAD model is identified representing an injection mold cavity. The mold cavity includes a location of at least one gate. A potential fill pattern is determined for injection of a material into the injection mold cavity. The determined fill pattern is based at least in part on the geometry and dimensions of the modeled mold cavity and the location of the at least one gate. A strip model of the CAD model is generated based at least in part on the determined fill pattern. The strip model is used to perform a strip analysis simulating injection of the material within the injection mold cavity.
Public/Granted literature
- US20120059637A1 INTERACTIVE FILLING SIMULATION ON 3D INJECTION MOLDING MODELS Public/Granted day:2012-03-08
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