Invention Grant
- Patent Title: Stacked semiconductor package
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Application No.: US13005101Application Date: 2011-01-12
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Publication No.: US08462511B2Publication Date: 2013-06-11
- Inventor: Seok-Chan Lee
- Applicant: Seok-Chan Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2010-0005294 20100120
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.
Public/Granted literature
- US20110176280A1 STACKED SEMICONDUCTOR PACKAGE Public/Granted day:2011-07-21
Information query
IPC分类:
