Within a dynamic array architecture, an irregular wire layout region within a portion of a chip level layout is bracketed by placing first and second regular wire layout shapes on a first and second sides, respectively, of the irregular wire layout region. One or more irregular wire layout shapes are placed within the irregular wire layout region. A first edge spacing is maintained between the first regular wire layout shape and a first outer irregular wire layout shape within the irregular wire layout region nearest to the first regular wire layout shape. A second edge spacing is maintained between the second regular wire layout shape and a second outer irregular wire layout shape within the irregular wire layout region nearest to the second regular wire layout shape. The first and second edge spacings are defined to optimize lithography of the regular and irregular wire layout shapes.