Invention Grant
- Patent Title: Earphone assembly
- Patent Title (中): 耳机装配
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Application No.: US13109001Application Date: 2011-05-17
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Publication No.: US08447062B2Publication Date: 2013-05-21
- Inventor: Chung-Shiang Lin
- Applicant: Chung-Shiang Lin
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010612703 20101229
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
An exemplary earphone assembly includes an electrical connector, two earphones, and two cords electrically connecting the electrical connector with the earphones. Each of the cords includes two wires connecting the electrical connector with a corresponding earphone and a zip chain containing the wires. The zip chain of each cord includes an elongated main body, and a first latching part and a second latching part protruding from the main body towards the other cord. A receiving groove is defined between the first and second latching parts for receiving the second latching part of the other cord when the two cords are engaged with each other in such a manner that the first and second latching parts of one cord block the second latching part of the other cord from escaping from the receiving groove.
Public/Granted literature
- US20120170789A1 EARPHONE ASSEMBLY Public/Granted day:2012-07-05
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