Invention Grant
- Patent Title: Dual earphone using both bone conduction and air conduction
- Patent Title (中): 双耳机使用骨传导和空气传导
-
Application No.: US13259995Application Date: 2009-05-29
-
Publication No.: US08447061B2Publication Date: 2013-05-21
- Inventor: Sang Chul Lee
- Applicant: Sang Chul Lee
- Applicant Address: KR Incheon
- Assignee: Vonia Corporation
- Current Assignee: Vonia Corporation
- Current Assignee Address: KR Incheon
- Agency: Novick, Kim & Lee, PLLC
- Agent Jae Youn Kim
- Priority: KR10-2009-0027144 20090330
- International Application: PCT/KR2009/002864 WO 20090529
- International Announcement: WO2010/114195 WO 20101007
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
Disclosed is an earphone set using both bone conduction and air conduction. The earphone set includes: a dual earphone which allows a user to selectively hear sounds from the front or rear side of the earphone set; a case cover provided at an end of the dual earphone; a cylindrical reinforcing frame assembled on one side of the case cover; a finishing ring mounted on the outer peripheral surface of the cylindrical reinforcing frame; a top cover assembled on one side of the cylindrical reinforcing frame and the finishing ring and having an extension projection at one side thereof; a rubber ear cap assembled at a front end of the extension projection to be inserted into an ear hole of a user; and a bone conduction vibrator provided inside the dual earphone.
Public/Granted literature
- US20120020501A1 DUAL EARPHONE USING BOTH BONE CONDUCTION AND AIR CONDUCTION Public/Granted day:2012-01-26
Information query