Invention Grant
US08446707B1 Circuitized substrate with low loss capacitive material and method of making same
有权
具有低损耗电容性材料的电路化基板及其制造方法
- Patent Title: Circuitized substrate with low loss capacitive material and method of making same
- Patent Title (中): 具有低损耗电容性材料的电路化基板及其制造方法
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Application No.: US13269770Application Date: 2011-10-10
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Publication No.: US08446707B1Publication Date: 2013-05-21
- Inventor: Rabindra N. Das , Konstantinos I. Papathomas , Voya R. Markovich , James J. McNamara
- Applicant: Rabindra N. Das , Konstantinos I. Papathomas , Voya R. Markovich , James J. McNamara
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell, LLP
- Agent Mark Levy
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.
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