Invention Grant
US08446578B2 Defect inspection apparatus, defect inspection method and method of inspecting hole pattern
有权
缺陷检查装置，缺陷检查方法和检查孔图案的方法
- Patent Title: Defect inspection apparatus, defect inspection method and method of inspecting hole pattern
- Patent Title (中): 缺陷检查装置，缺陷检查方法和检查孔图案的方法
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Application No.: US12591298Application Date: 2009-11-16
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Publication No.: US08446578B2Publication Date: 2013-05-21
- Inventor: Mari Sugihara , Takeo Oomori , Kazuhiko Fukazawa
- Applicant: Mari Sugihara , Takeo Oomori , Kazuhiko Fukazawa
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-085185 20030326; JP2004-322905 20041006
- Main IPC: G01N21/94
- IPC: G01N21/94
Abstract:
A defect inspection apparatus for inspecting a defect of a substrate as an object to be inspected comprises an illumination optical system for illuminating the substrate, a receiving optical system for receiving diffracted light from the substrate and a polarizing element provided in either one of the illumination optical system or the receiving optical system.
Public/Granted literature
- US20100103419A1 Defect inspection apparatus, defect inspection method and method of inspecting hole pattern Public/Granted day:2010-04-29
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