A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.