Invention Grant
- Patent Title: Method and device for resistive multi-point touch
- Patent Title (中): 电阻式多点触摸的方法和装置
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Application No.: US12640753Application Date: 2009-12-17
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Publication No.: US08446380B2Publication Date: 2013-05-21
- Inventor: Chin-Fu Chang , Shang-Tai Yeh
- Applicant: Chin-Fu Chang , Shang-Tai Yeh
- Applicant Address: TW Taipei
- Assignee: Egalax—Empia Technology Inc.
- Current Assignee: Egalax—Empia Technology Inc.
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW98112745A 20090417
- Main IPC: G06F3/041
- IPC: G06F3/041

Abstract:
A resistive multi-point touch device and method is disclosed. A plurality of wires intersect each other to form a plurality of intersecting regions. The intersecting wires are separated from each other by a plurality of insulating particles. First, suppressed intersecting regions are sensed, and then contact points on the suppressed intersecting regions are sensed based on the suppressed intersecting regions. Sensing of the suppressed intersecting regions is performed by first sensing suppressed wires, and then determining possibly suppressed intersecting regions based on the suppressed wires, and sensing suppressed intersecting regions based on these possibly suppressed intersecting regions.
Public/Granted literature
- US20100263943A1 Method and Device for Resistive Multi-point Touch Public/Granted day:2010-10-21
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