Invention Grant
- Patent Title: MEMS relay and method of forming the MEMS relay
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Application No.: US13739587Application Date: 2013-01-11
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Publication No.: US08446237B1Publication Date: 2013-05-21
- Inventor: Dok Won Lee , Peter Johnson , Aditi Dutt Chaudhuri
- Applicant: National Semiconductor Corporation
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Eugene C. Conser; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01H51/22
- IPC: H01H51/22
Abstract:
A micro-electromechanical systems (MEMS) relay includes a switch with a first contact region and a second contact region that are vertically separated from each other by a gap. The MEMS relay requires a small vertical movement to close the gap and therefore is mechanically robust. In addition, the MEMS relay has a small footprint and, therefore, can be formed on top of small integrated circuits.
Public/Granted literature
- US20130122628A1 MEMS Relay and Method of Forming the MEMS Relay Public/Granted day:2013-05-16
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