Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12972404Application Date: 2010-12-17
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Publication No.: US08445957B2Publication Date: 2013-05-21
- Inventor: Ae Kyung Jin
- Applicant: Ae Kyung Jin
- Applicant Address: KR Icheon
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2010-0032726 20100409
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28

Abstract:
A gate formed in a peripheral region is buried in a semiconductor device such that bit line contact plugs respectively coupled to an active region and the gate are simultaneously formed and a short-circuit between the gate and the bit line contact plug is prevented, thereby improving the characteristics of the device. The method of manufacturing the semiconductor device includes forming a gate buried in a semiconductor substrate, and forming a first bit line contact plug coupled to the gate and a second bit line contact plug coupled to the semiconductor substrate.
Public/Granted literature
- US20110248336A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-10-13
Information query
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