Invention Grant
US08445907B2 Semiconductor device including process monitoring pattern having overlapping input/output pad array area 有权
半导体器件包括具有重叠的输入/输出焊盘阵列区域的处理监视模式

Semiconductor device including process monitoring pattern having overlapping input/output pad array area
Abstract:
The semiconductor device includes a process monitoring pattern and an input/output (I/O) pad array area, the process monitoring pattern including a lower layer having a peripheral area surrounding a first internal area, the first internal area exposed by an internal open area, an external structure on the peripheral area of the lower layer, and a first dam disposed in the peripheral area spaced apart from the external structure by an external open area, the first dam defining the first internal area. The peripheral area overlaps the input/output (I/O) pad array area of the semiconductor device.
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