Invention Grant
- Patent Title: Manufacturing method of semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US13463276Application Date: 2012-05-03
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Publication No.: US08445901B2Publication Date: 2013-05-21
- Inventor: Shinji Maekawa
- Applicant: Shinji Maekawa
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2004-251926 20040831
- Main IPC: H01L35/24
- IPC: H01L35/24

Abstract:
In view of the problem that an organic semiconductor layer of an organic TFT is likely to deteriorate due to water, light, oxygen, or the like, it is an object of the present invention to simplify a manufacturing step and to provide a method for manufacturing a semiconductor device having an organic TFT with high reliability. According to the invention, a semiconductor layer containing an organic material is formed by patterning using a mask, and thus an organic TFT is completed in the state where the mask is not removed but to remain over the semiconductor layer. In addition, a semiconductor layer can be protected from deterioration due to water, light, oxygen, or the like by using the remaining mask.
Public/Granted literature
- US20120211737A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2012-08-23
Information query
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