Invention Grant
- Patent Title: Method of making a radiation-sensitive substrate
- Patent Title (中): 制造辐射敏感基材的方法
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Application No.: US13214550Application Date: 2011-08-22
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Publication No.: US08445853B2Publication Date: 2013-05-21
- Inventor: Ronald Steven Cok
- Applicant: Ronald Steven Cok
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A method of making a radiation-sensitive apparatus includes providing a first substrate, forming a radiation-sensitive layer over the first substrate, providing a plurality of spatially separated integrated circuits, each integrated circuit having: a second substrate, one or more electronic circuit(s) formed in or on the second substrate, and one or more electrode connection pads formed in or on the second substrate, each electrode connection pad electrically connected to at least one of the electronic circuit(s). A plurality of pixel electrodes is formed over the first substrate separate from the integrated circuit, each pixel electrode electrically connected to an electrode connection pad. An electronic control circuit is electrically connected to each electronic circuit in each integrated circuit. The electronic circuits are responsive to electrical signals formed by the interaction of electromagnetic radiation and the radiation-sensitive layer, the electrical signals conducted by the pixel electrodes and electrode connection pads.
Public/Granted literature
- US20130048868A1 METHOD OF MAKING A RADIATION-SENSITIVE SUBSTRATE Public/Granted day:2013-02-28
Information query
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