Invention Grant
US08444841B2 Partial plating method, a laser plating device, and a plated material
失效
部分电镀法,激光电镀装置以及电镀材料
- Patent Title: Partial plating method, a laser plating device, and a plated material
- Patent Title (中): 部分电镀法,激光电镀装置以及电镀材料
-
Application No.: US12309468Application Date: 2007-08-07
-
Publication No.: US08444841B2Publication Date: 2013-05-21
- Inventor: Koukichi Haga
- Applicant: Koukichi Haga
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-214168 20060807; JP2007-129119 20070515
- International Application: PCT/JP2007/065464 WO 20070807
- International Announcement: WO2008/018471 WO 20080214
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D5/00

Abstract:
A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device.
Public/Granted literature
- US20090288955A1 PARTIAL PLATING METHOD, A LASER PLATING DEVICE, AND A PLATED MATERIAL Public/Granted day:2009-11-26
Information query