Invention Grant
- Patent Title: Take-up machine
- Patent Title (中): 收线机
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Application No.: US13078033Application Date: 2011-04-01
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Publication No.: US08443965B2Publication Date: 2013-05-21
- Inventor: Koji Matsuda
- Applicant: Koji Matsuda
- Applicant Address: JP
- Assignee: YKK Corporation
- Current Assignee: YKK Corporation
- Current Assignee Address: JP
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2010-088406 20100407
- Main IPC: B29C47/30
- IPC: B29C47/30

Abstract:
A take-up machine is provided. Each of upper and lower conveying devices has an endless rotating body and a plurality of take-up pads provided on the surface of the endless rotating body. The take-up machine is configured to pinch a top face and a bottom face of a resin-molded article with the take-up pads of the upper and lower conveying devices to take up the resin-molded article. The take-up machine is installed along an extrusion line of a resin extruder. In a lateral direction orthogonal to an extrusion line, a length of each of the take-up pads is multiple times a length of the resin-molded article to be taken up. Each of the take-up pads has a plurality of supporting potions which are arranged in the lateral direction and capable of supporting resin-molded articles with different shapes. The upper and lower conveying devices are movable in the lateral direction so as to make one of the supporting portions coincide with the extrusion line.
Public/Granted literature
- US20110247917A1 Take-Up Machine Public/Granted day:2011-10-13
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