A manually operated or automated bonding tool for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool includes a loading module in which the bare bonding part is loaded, an oven module in which the bare bonding part is heated, an adhesive picking station module in which the adhesive is attached to the heated bare bonding part, and a part transfer module which advances the bare bonding part sequentially from the loading module, through the oven module, and to the adhesive picking station module. The oven module includes an elongated heating block having a bonding part guide by which the bare bonding parts are transferred through the oven and to the adhesive picking station module. The part transfer module is used to push the unheated bare bonding part into and through the oven module and into position on the adhesive picking station module.