Invention Grant
- Patent Title: Medical electrical lead with embedded electrode sub-assembly
- Patent Title (中): 医用电线带嵌入式电极子组件
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Application No.: US12626984Application Date: 2009-11-30
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Publication No.: US08437864B2Publication Date: 2013-05-07
- Inventor: Kevin R. Seifert
- Applicant: Kevin R. Seifert
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
A medical electrical lead that includes a lead body and at least one tubular electrode sub-assembly positioned over and attached to the lead body. The lead body includes at least one elongated conductive element, such as a cable, that is electrically connected to a coiled electrode of the tubular electrode sub-assembly. The tubular electrode sub-assembly includes a tubular liner and an electrode embedded in the outer surface of the liner. In some embodiments, only a portion of the inner surface of the tubular liner is attached to the lead body in order to improve flexibility of the medical electrode lead in the area occupied by the tubular electrode sub-assembly.
Public/Granted literature
- US20100137958A1 MEDICAL ELECTRICAL LEAD WITH EMBEDDED ELECTRODE SUB-ASSEMBLY Public/Granted day:2010-06-03
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