Invention Grant
- Patent Title: Integrated electromechanical relays
- Patent Title (中): 集成机电继电器
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Application No.: US12701957Application Date: 2010-02-08
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Publication No.: US08436701B2Publication Date: 2013-05-07
- Inventor: Christian Wilhelmus Baks , Richard A. John , Young Hoon Kwark
- Applicant: Christian Wilhelmus Baks , Richard A. John , Young Hoon Kwark
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Anne V. Dougherty
- Main IPC: H01H51/22
- IPC: H01H51/22

Abstract:
Electromechanical relays and semiconductor structures and microelectromechanical systems including at least part of an electromechanical relay are presented. For example, an electromechanical relay includes an electrically conductive terminal within a printed circuit board, one or more electrically conductive contacts, and one or more magnetic actuators. The one or more magnetic actuators are respectively associated with the one or more electrically conductive contacts and each magnetic actuator includes (i) a magnetic core within at least one via extending through one or more layers of the printed circuit board, and (ii) an electrical coil around at least a portion of the magnetic core and within one or more layers of the printed circuit board. Activation of the one or more actuators causes electrical contact between the terminal and an associated one of the one or more electrically conductive contacts.
Public/Granted literature
- US20110193661A1 Integrated Electromechanical Relays Public/Granted day:2011-08-11
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