Invention Grant
- Patent Title: Cascaded-based de-embedding methodology
- Patent Title (中): 基于级联的去嵌入方法
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Application No.: US12640138Application Date: 2009-12-17
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Publication No.: US08436626B2Publication Date: 2013-05-07
- Inventor: Hsiu-Ying Cho
- Applicant: Hsiu-Ying Cho
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manfacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manfacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G01R27/28
- IPC: G01R27/28

Abstract:
An embodiment is a method for de-embedding. The method comprises forming a primary structure in a semiconductor chip and forming an auxiliary structure in the semiconductor chip. The auxiliary structure replicates a first portion of the primary structure. The method further comprises determining a transmission matrix for each of the primary structure and the auxiliary structure based on measurements and extracting a transmission matrix of a first component of the primary structure by determining a product of the transmission matrix of the primary structure and an inverse of the transmission matrix of the auxiliary structure.
Public/Granted literature
- US20110151596A1 Cascaded-Based De-embedding Methodology Public/Granted day:2011-06-23
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