A low pin count IC includes a wireless power receive coil, a rectifying circuit, an output circuit, circuit modules, a power management unit (PMU), a die, and a package substrate. The wireless power receive coil generates an AC voltage from a wireless power electromagnetic signal and the rectifying circuit generates a rectified voltage from the AC voltage. The output circuit generates a DC voltage from the rectified voltage. The PMU manages distribution of the DC voltage to the circuit modules. The die supports the circuit modules and the PMU, wherein the die includes return pads for coupling to circuit return nodes and a PMU return node. The package substrate supports the die and includes return pins for coupling to the return pads, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit.