Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US13423306Application Date: 2012-03-19
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Publication No.: US08436480B2Publication Date: 2013-05-07
- Inventor: Tae Yamane
- Applicant: Tae Yamane
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package including a semiconductor chip; a base member on which the semiconductor chip is mounted; a plurality of leads formed on the base member, the leads including inner ends electrically connected to the semiconductor chip and outer ends; and an index for identifying locations of specific leads.
Public/Granted literature
- US20120175787A1 SEMICONDUCTOR PACKAGE Public/Granted day:2012-07-12
Information query
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