A semiconductor integrated circuit includes first power supply through-chip vias formed through the semiconductor chip to be in a line in a first direction of the semiconductor chip, second power supply through-chip vias formed through the semiconductor chip to be in, first power lines arranged in a second direction, wherein each of the plurality of first power lines is coupled to each of the first power supply through-chip vias, and second power lines arranged in the second direction, wherein each of the plurality of second power lines is coupled to each of the second power supply through-chip vias.