Invention Grant
- Patent Title: Hollow sealing structure and manufacturing method for hollow sealing structure
- Patent Title (中): 中空密封结构的空心密封结构和制造方法
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Application No.: US13041562Application Date: 2011-03-07
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Publication No.: US08436464B2Publication Date: 2013-05-07
- Inventor: Susumu Obata , Tatsuya Ohguro
- Applicant: Susumu Obata , Tatsuya Ohguro
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-145830 20070531
- Main IPC: H01L23/12
- IPC: H01L23/12

Abstract:
A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substrate, a process for forming a second sacrificial layer on the functional element portion so as to be connected to a part of the first sacrificial layer, a process for forming a covering portion over respective surfaces of the first and second sacrificial layers, a process for circulating a fluid for sacrificial layer removal through an opening in the covering portion in contact with the first sacrificial layer, thereby removing the first and second sacrificial layers, and a process for closing the opening.
Public/Granted literature
- US20110148045A1 HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE Public/Granted day:2011-06-23
Information query
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