Invention Grant
- Patent Title: Diodes with embedded dummy gate electrodes
- Patent Title (中): 具有嵌入式虚拟栅电极的二极管
-
Application No.: US13082871Application Date: 2011-04-08
-
Publication No.: US08436430B2Publication Date: 2013-05-07
- Inventor: Ming-Hsin Yu , Kvei-Feng Yen
- Applicant: Ming-Hsin Yu , Kvei-Feng Yen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/772
- IPC: H01L29/772

Abstract:
A circuit structure includes a first isolation region, and a first dummy gate electrode over and vertically overlapping the first isolation region. First pickup regions of a diode are formed on opposite sides of the first isolation region, wherein sidewalls of the first pickup regions contact opposite sidewalls of the first isolation region. Second pickup regions of the diode are formed on opposite sides of a combined region of the first pickup regions and the first isolation region, wherein the first and the second pickup regions are of opposite conductive types. A well region is under the first and the second pickup regions and the first isolation region, wherein the well region is of a same conductivity type as the second pickup regions.
Public/Granted literature
- US20120256292A1 Diodes with Embedded Dummy Gate Electrodes Public/Granted day:2012-10-11
Information query
IPC分类: