Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12250872Application Date: 2008-10-14
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Publication No.: US08436420B2Publication Date: 2013-05-07
- Inventor: Kyu Hyun Mo
- Applicant: Kyu Hyun Mo
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2007-0112932 20071107
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Disclosed are a semiconductor device and a manufacturing method thereof. The semiconductor device can include a recess formed in an active area of a semiconductor substrate, an insulating layer formed in the recess, a source electrode and a drain electrode spaced apart from the source electrode on the insulating layer, a carbon nanotube layer formed between the source and drain electrodes, an oxide layer pattern covering at least the carbon nanotube layer, and a gate electrode formed on the oxide layer pattern.
Public/Granted literature
- US20110168983A1 Semiconductor Device and Manufacturing Method Thereof Public/Granted day:2011-07-14
Information query
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