Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method for manufacturing same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US12839784Application Date: 2010-07-20
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Publication No.: US08436416B2Publication Date: 2013-05-07
- Inventor: Daigo Ichinose , Tadashi Iguchi
- Applicant: Daigo Ichinose , Tadashi Iguchi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-263830 20091119
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/8246

Abstract:
According to one embodiment, a nonvolatile semiconductor memory device includes a substrate, a stacked body, a plurality of semiconductor pillars and a charge storage film. The stacked body is provided on the substrate, with a plurality of insulating films alternately stacked with a plurality of electrode films, and includes a hydrophobic layer provided between one of the insulating films and one of the electrode films. The hydrophobic layer has higher hydrophobicity than the electrode films. The plurality of semiconductor pillars extend in a stacking direction of the stacked body and pierce the stacked body, and the charge storage film is provided between the electrode films and one of the semiconductor pillars.
Public/Granted literature
- US20110115014A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-05-19
Information query
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