Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method of manufacturing the same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
-
Application No.: US12723981Application Date: 2010-03-15
-
Publication No.: US08436415B2Publication Date: 2013-05-07
- Inventor: Masaru Kidoh , Ryota Katsumata , Masaru Kito , Yoshiaki Fukuzumi , Hiroyasu Tanaka , Yosuke Komori , Megumi Ishiduki , Tomoko Fujiwara , Hideaki Aochi , Ryouhei Kirisawa , Yoshimasa Mikajiri , Shigeto Oota
- Applicant: Masaru Kidoh , Ryota Katsumata , Masaru Kito , Yoshiaki Fukuzumi , Hiroyasu Tanaka , Yosuke Komori , Megumi Ishiduki , Tomoko Fujiwara , Hideaki Aochi , Ryouhei Kirisawa , Yoshimasa Mikajiri , Shigeto Oota
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-203075 20090902
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
A memory string comprises: a first semiconductor layer including a columnar portion extending in a stacking direction on a substrate; a first charge storage layer surrounding the columnar portion; and a plurality of first conductive layers stacked on the substrate so as to surround the first charge storage layer. A select transistor comprises: a second semiconductor layer in contact with an upper surface of the columnar portion and extending in the stacking direction; a second charge storage layer surrounding the second semiconductor layer; and a second conductive layer deposited above the first conductive layer to surround the second charge storage layer. The second charge storage layer is formed from a layer downward of the second conductive layer to an upper end vicinity of the second conductive layer, and is not formed in a layer upward of the upper end vicinity.
Public/Granted literature
- US20110049608A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-03-03
Information query
IPC分类: