Invention Grant
US08436117B2 Stimuli responsive compound, stimuli responsive compound polymer, actuator and method for manufacturing stimuli responsive compound 有权
刺激响应性化合物,刺激响应性复合聚合物,致动器和制造刺激响应化合物的方法

  • Patent Title: Stimuli responsive compound, stimuli responsive compound polymer, actuator and method for manufacturing stimuli responsive compound
  • Patent Title (中): 刺激响应性化合物,刺激响应性复合聚合物,致动器和制造刺激响应化合物的方法
  • Application No.: US13019578
    Application Date: 2011-02-02
  • Publication No.: US08436117B2
    Publication Date: 2013-05-07
  • Inventor: Toshihiro Otake
  • Applicant: Toshihiro Otake
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2010-023811 20100205
  • Main IPC: C07D339/06
  • IPC: C07D339/06 C08F28/06
Stimuli responsive compound, stimuli responsive compound polymer, actuator and method for manufacturing stimuli responsive compound
Abstract:
A stimuli responsive compound includes: a unit A having bonds that function as rotation axes; a first unit B disposed at a first bonding section of the unit A; a second unit B disposed at a second bonding section of the unit A; a first unit C disposed at a third bonding section of the unit A; and a second unit C disposed at a fourth bonding section of the unit A. The first unit B bonds with the second unit B by oxidation-reduction reaction, and the first unit C and the second unit C have liquid crystallinity and include polymerizable functional groups.
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