Invention Grant
- Patent Title: Method of manufacturing semiconductor device comprising the step of doping semiconductor film through contact hole
- Patent Title (中): 制造半导体器件的方法包括通过接触孔掺杂半导体膜的步骤
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Application No.: US12908521Application Date: 2010-10-20
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Publication No.: US08435892B2Publication Date: 2013-05-07
- Inventor: Atsuo Isobe , Keiko Saito , Tomohiko Sato
- Applicant: Atsuo Isobe , Keiko Saito , Tomohiko Sato
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2005-241734 20050823
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
It is an object of an invention disclosed in the present specification to provide a transistor having low contact resistance. In the transistor, a semiconductor film including an impurity element imparting P-type or N-type conductivity, an insulating film formed thereover, and an electrode or a wiring that is electrically connected to the semiconductor film through a contact hole formed at least in the insulating film are included; the semiconductor film has a first range of a concentration of the impurity element (1×1020/cm3 or less) that is included in a deeper region than predetermined depth, and a second range of a concentration of the impurity element (more than 1×1020/cm3) that is included in a shallower region than the predetermined depth; and a deeper region than a portion in contact with the electrode or the wiring in the semiconductor film is in the first range of the concentration of the impurity element.
Public/Granted literature
- US20110033990A1 TRANSISTOR, AND DISPLAY DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2011-02-10
Information query
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