Invention Grant
US08435892B2 Method of manufacturing semiconductor device comprising the step of doping semiconductor film through contact hole 有权
制造半导体器件的方法包括通过接触孔掺杂半导体膜的步骤

Method of manufacturing semiconductor device comprising the step of doping semiconductor film through contact hole
Abstract:
It is an object of an invention disclosed in the present specification to provide a transistor having low contact resistance. In the transistor, a semiconductor film including an impurity element imparting P-type or N-type conductivity, an insulating film formed thereover, and an electrode or a wiring that is electrically connected to the semiconductor film through a contact hole formed at least in the insulating film are included; the semiconductor film has a first range of a concentration of the impurity element (1×1020/cm3 or less) that is included in a deeper region than predetermined depth, and a second range of a concentration of the impurity element (more than 1×1020/cm3) that is included in a shallower region than the predetermined depth; and a deeper region than a portion in contact with the electrode or the wiring in the semiconductor film is in the first range of the concentration of the impurity element.
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