Invention Grant
US08435889B2 Methods of forming CoSi2, methods of forming field effect transistors, and methods of forming conductive contacts
有权
形成CoSi2的方法,形成场效应晶体管的方法以及形成导电触点的方法
- Patent Title: Methods of forming CoSi2, methods of forming field effect transistors, and methods of forming conductive contacts
- Patent Title (中): 形成CoSi2的方法,形成场效应晶体管的方法以及形成导电触点的方法
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Application No.: US13182285Application Date: 2011-07-13
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Publication No.: US08435889B2Publication Date: 2013-05-07
- Inventor: Yongjun Jeff Hu
- Applicant: Yongjun Jeff Hu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/43

Abstract:
The invention included to methods of forming CoSi2, methods of forming field effect transistors, and methods of forming conductive contacts. In one implementation, a method of forming CoSi2 includes forming a substantially amorphous layer comprising MSix over a silicon-containing substrate, where “M” comprises at least some metal other than cobalt. A layer comprising cobalt is deposited over the substantially amorphous MSix-comprising layer. The substrate is annealed effective to diffuse cobalt of the cobalt-comprising layer through the substantially amorphous MSix-comprising layer and combine with silicon of the silicon-containing substrate to form CoSi2 beneath the substantially amorphous MSix-comprising layer. Other aspects and implementations are contemplated.
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