Invention Grant
- Patent Title: Thin plug assembly and methods for making the same
- Patent Title (中): 薄插头组件及其制作方法
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Application No.: US13077027Application Date: 2011-03-31
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Publication No.: US08435081B2Publication Date: 2013-05-07
- Inventor: Jonathan Aase
- Applicant: Jonathan Aase
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
Thin plug assemblies and methods for constructing the same are disclosed. The plug assembly can include a plug portion, a cable portion, and an interfacing portion between the plug portion and the cable portion. The plug portion can include several conductive regions each connected to a conductor of the cable portion to form conductor/plug member coupling(s), for example via a plug extension member associated with each conductive region. The plug assembly is constructed such that a diameter of the plug portion, interface portion, and at least part of the cable portion have substantially the same diameter. Ring structures enhance one or more of the conductor/plug member couplings by providing a press or interference fit directly to the coupling(s). Ring structures are constructed to slide axially over at least one conductor and at least one plug member.
Public/Granted literature
- US20110243360A1 THIN PLUG ASSEMBLY AND METHODS FOR MAKING THE SAME Public/Granted day:2011-10-06
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