The present invention heightens positional accuracy of a plurality of conductive paths provided in a resilient connecting board and having connected thereto a plurality of probes. An electrical connecting apparatus includes a connecting board and a plurality of probes arranged on a lower side of the connecting board. The connecting board includes a first board having resiliency, a first sheet-like member arranged on a lower side of the first board, and a plurality of conductive paths passing through the first sheet-like member in an up-down direction. The probes are connected to lower ends of the conductive paths. The first sheet-like member is made of a photosensitive resin.