Invention Grant
- Patent Title: Batch wafer alignment
- Patent Title (中): 批量晶圆对准
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Application No.: US12030902Application Date: 2008-02-14
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Publication No.: US08434989B2Publication Date: 2013-05-07
- Inventor: Peter van der Meulen
- Applicant: Peter van der Meulen
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin Durham
- Main IPC: B65G49/07
- IPC: B65G49/07

Abstract:
Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
Public/Granted literature
- US20080131237A1 Batch Wafer Alignment Public/Granted day:2008-06-05
Information query
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